SEMIXICON Mini-Burl Low-Contact SiC Wafer Chuck
SEMIXICON Mini-Burl low-contact wafer chucks are designed for advanced lithography and semiconductor wafer-processing applications where backside particle contamination, wafer flatness, and chuck-induced focus errors are critical concerns. Manufactured from high-purity silicon carbide (SiC), the chuck combines high stiffness, excellent thermal stability, low particle generation, and outstanding chemical resistance.
The Mini-Burl architecture minimizes the wafer-to-chuck contact area, reducing the influence of backside particles and contamination on wafer positioning and local wafer deformation. The distributed micro-contact structure also enables effective vacuum holding while maintaining high wafer stability and repeatable chucking performance.
SiC Pin Chuck Option
SEMIXICON also provides SiC pin chucks, using precisely engineered SiC support pins to minimize wafer contact while maintaining reliable mechanical support and vacuum control. The low-contact design facilitates backside contamination management and reduces the potential for particle-induced wafer distortion.
Key advantages:
High-purity SiC construction
Ultra-low wafer contact area
Excellent dimensional and thermal stability
High chemical and plasma resistance
Low particle generation
Reduced sensitivity to backside contamination
Suitable for lithography, coating, inspection, and advanced wafer processing
Custom pin geometry, pitch, thickness, and vacuum-zone configurations available
SEMIXICON's SiC Mini-Burl and pin-chuck platforms provide a robust low-contact solution for high-precision wafer handling where particle control and wafer flatness are essential.
