Ultra-Thin. Ultra-Smooth. Ultra-High Thermal Performance.
DIASEMI ultra thin micron level thickness ulta smooth nanometer roughness CVD diamond heatspreader interposer
Ultra-Thin, Ultra-Fine Polished CVD Diamond Heat-Spreader Interposer
Engineered for next-generation advanced semiconductor packaging, DIASEMI CVD diamond interposers combine exceptional in-plane thermal conductivity with ultra-thin geometry and ultra-fine surface finish. The platform enables efficient heat spreading directly beneath high-power devices while maintaining the dimensional precision and surface quality required for wafer-level bonding, hybrid integration, and advanced packaging.
