Copper Diamond Composite Heatsink Diasemi
Any size up to 150 um
Thermal conductivity up to 1000 W/mk
Metalization optional of Cu, Ag, Au etc
Surface roughnes of nanometer
Diamond content particle size and layout can be structured and fine tuned
Copper Diamond Composite Heatsink Diasemi
Any size up to 150 um
Thermal conductivity up to 1000 W/mk
Metalization optional of Cu, Ag, Au etc
Surface roughnes of nanometer
Diamond content particle size and layout can be structured and fine tuned
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