DLC coating and Laser surface texturing patterning of semiconductor wafer chuck

DLC coating and Laser surface texturing patterning of semiconductor wafer chuck

Surface texturing enhances the functional performance of semiconductor wafer chucks by introducing micro-patterns such as dimples, rings, and grooves on the wafer chuck tables and carriers. These patterns help reduce vacuum leakage, improve thermal and mechanical contact, and optimize wafer handling. In addition, applying Diamond-Like Carbon (DLC) coatings significantly enhances lubrication and minimizes surface particle contamination between the wafer chuck and semiconductor wafers—an increasingly critical factor in advanced semiconductor manufacturing.

This innovative solution, developed by CERAMERIC SEMIXICON, has been instrumental in helping fabrication facilities worldwide improve operational efficiency, reduce waste and production costs, and significantly increase yield rates.