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02-27-2024

Ultra High Thermal Conductivity PECVD Diamond Film Deposition Si Wafer

DIASEMI  is a recent spin off from CEREAMERIC SEMIXICON’’s  diamond semiconductor application researching and development center ,the new adventure is aiming to implement innovative new technology of synthetic diamond into developing and producing the next generation wide band gap semiconductor materials.

DIASEMI is steered by successful series entrepreneurs with extensive experience in the semiconductor industry and backed by world leading synthetic diamond scientists.

The recent product /service introduced by DIASEMI is Ultra High Thermal Conductivity PECVD Diamond Coated Si Wafer , customers can order standard DIASEMI diamond coated wafer or can order customized coating service with specified wafer type, wafer size ,diamond coating thickness etc.


The current standard DIASEMI DIASI products are as below accepting orders.


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