TDV — Through-Diamond Via

Through-Diamond Via (TDV) is an advanced vertical interconnect technology that creates high-aspect-ratio through-holes in diamond substrates and fills them with conductive metals such as copper. Unlike conventional TSVs, TDV combines vertical electrical interconnection with ultra-high thermal conductivity, leveraging diamond’s exceptional thermal conductivity, electrical insulation, low CTE, and mechanical stability.

TDV enables simultaneous signal/power routing and heat extraction, making it particularly attractive for next-generation 3D semiconductor packaging, GaN and SiC power devices, RF electronics, AI/HPC accelerators, and high-power-density systems.

A typical TDV process involves precision via formation, sidewall conditioning, metallization, diffusion-barrier deposition, and void-free metal filling, with dimensional control and interface reliability being critical to performance.