High-Precision Semiconductor Dicing Flanges from SEMIXICON

High-Precision Semiconductor Dicing Flanges from SEMIXICON

Precision starts with a stable blade mounting system.

SEMIXICON manufactures high-accuracy dicing flanges designed for semiconductor wafer dicing, ceramic substrate processing, optical glass cutting, and advanced materials machining. Our flanges are compatible with major dicing platforms and engineered to deliver exceptional spindle stability, cutting accuracy, and process consistency.

Key Specifications:

 Face Runout: ≤ 2 μm
 Radial Runout: ≤ 3 μm
 Vibration Intensity: ≤ 0.4 mm/s
 High-precision balancing and machining
 Excellent blade clamping stability for high-speed dicing operations

Available Types:

 Hubless Flange
• Designed for clamping dicing blades without a hub

 Hub Flange
• Designed for clamping dicing blades with a hub

Compatible Equipment:

 DISCO DAD321, DAD322, DAD341
 DISCO DFD641, DFD651
 DISCO DFD3350, DFD3650
 DISCO DFD6360, DFD6361, DFD6362
 TSK5000K, TSK200T, TSK300TX
 ADT 7000 Series
 HEYAN TECH Systems
 CETC Dicing Platforms

Applications:

 Semiconductor Wafer Dicing
 SiC and GaN Devices
 Ceramic Substrates
 Optical Glass Processing
 MEMS Devices
 Advanced Packaging and Precision Cutting Services