Panel level packaging and SEMIXICON EXtra Large Porous Ceramic Vacuum Chuck
WLP Wafer level packaging Vs PLP Panel level packaging and
CERAMERIC EXtra Large Porous Ceramic Vacuum Chuck
| Feature | Wafer-Level Packaging (WLP) | Panel-Level Packaging (PLP) |
|---|---|---|
| Substrate shape | Circular wafer (200–300 mm) | Rectangular panel (up to 600 mm) |
| Typical material | Silicon wafer | Organic, glass, or molded panel |
| Die placement | Native wafer | Reconstituted panel (fan-out) |
| Cost efficiency | Moderate | Higher (more dies per batch) |
| Size scalability | Limited (≤300 mm) | Large-scale, panel-based |
| Process maturity | High (mass production) | Emerging / developing |
| Target devices | Mobile ICs, sensors | High-density, large-area modules |
| Integration | Mostly single-die | Multi-die, heterogeneous possible |
Once again, we are ready to take the "extra large" challenge
CERAMERIC SEMIXICON is supplying panel level packaging porous ceramic chuck
1064x40x991 mm
1064x40x701x701mm
extra large porous ceramic vacuum chuck
#PSG011-P03001-01
#Panel level packaging
