DISCO Wafer Grinding /Polisher Ceramic Components by SEMIXICON

DISCO Wafer Grinding /Polisher Ceramic Components by SEMIXICON

DAD3350 Dicing Machine modified from 8 inch to 12 inch by SEMIXICON

DAD3350 Dicing Machine modified from 8 inch to 12 inch by SEMIXICON

DISTRIBUTION AGREEMENT WITH PORTEC AG SWITZERLAND

DLC Coating on Semiconductor Wafer Pin Chuck from SEMIXICON CERAMERIC

DLC Coating on Semiconductor Wafer Pin Chuck from SEMIXICON CERAMERIC

Happy new year 2022

Wafer Chuck ,Porous Chuck, Grinding Chuck

You have our back for those discontinued equipment from DISCO etc

Discontinued equipment from DISCO